MULTI-BEAM CHIP INTEGRATION MODULE AND PHASED ARRAY SYSTEM

WIPO Patent Application WO/2022/227763

A1

A multi-beam chip integration module (10) and a phased array system. The multi-beam chip integration module comprises a first printed board (103), at least one group of first-type chips (101) and at least one group of second-type chips (102), wherein the at least one group of first-type chips are surface-mounted on a first side of the first printed board; and the at least one group of second-type chips are surface-mounted on a second side of the first printed board, the second side of the first printed board being an opposite side that is parallel to the first side of the first printed board. When the quantities and sizes (specifications) of first-type chips and second-type chips do not change, the first-type chips and the second-type chips are respectively surface-mounted on two sides of a first printed board, and in comparison with the first-type chips and the second-type chips being surface-mounted on one side of the first printed board, the required area of the first printed board is smaller, that is, the size is smaller. Therefore, a chip layout after the size of a printed board is reduced can be satisfied, and the wiring complexity of an antenna network is reduced, such that the layout of a multi-beam phased array network can be completed easily and quickly.

LIU HUIQI (CN)
ZHAO DIXIAN (CN)
YOU XIAOHU (CN)
CHEN ZHIHUI (CN)

PCT/CN2022/074997

November 03, 2022

January 29, 2022

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CHENGDU T RAY TECH CO LTD (CN)
UNIV SOUTHEAST (CN)

H05K1/18; H01Q21/06; H01Q25/00

CN113141708A	2021-07-20
CN112003003A	2020-11-27
US10757812B1	2020-08-25
CN111541470A	2020-08-14

YUANHE UNITED INTELLECTUAL PROPERTY PARTNERS (CN)

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