Title:
MULTI-CHANNEL AIP ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/109528
Kind Code:
A1
Abstract:
A multi-channel AiP encapsulation structure (100), comprising: a first antenna (110); a first plastic encapsulation layer (120), said first plastic encapsulation layer (120) being arranged below the first antenna (110); a first re-layout and wiring layer (140), said first re-layout and wiring layer (140) being arranged below the first plastic encapsulation layer (120); a second plastic encapsulation layer (150), said second plastic encapsulation layer (150) being arranged below the first re-layout and wiring layer (140); a second plastic encapsulation layer conductive through hole (160), said second plastic encapsulation layer conductive through hole (160) penetrating the upper and lower surfaces of the second plastic encapsulation layer (150) and being electrically connected to the first re-layout and wiring layer (140); a chip (170), said chip (170) being covered by the second plastic encapsulation layer (150) and a front face pin of the chip (170) being exposed out of the bottom face of the second plastic encapsulation layer (150); a second re-layout and wiring layer (180), said second re-layout and wiring layer (180) being arranged below the second plastic encapsulation layer (150) and being electrically connected to the second plastic encapsulation layer conductive through hole (160) and the pin of the chip (170); and external solder bumps (190), said external solder bumps (190) being arranged below the second re-layout and wiring layer (180) and being electrically connected to the second re-layout and wiring layer (180).
Inventors:
CAO LIQIANG (CN)
LI JUN (CN)
CHEN FENG (CN)
CHEN YING (CN)
LI JUN (CN)
CHEN FENG (CN)
CHEN YING (CN)
Application Number:
PCT/CN2020/095307
Publication Date:
June 10, 2021
Filing Date:
June 10, 2020
Export Citation:
Assignee:
SHANGHAI XIANFANG SEMICONDUCTOR CO LTD (CN)
NAT CENTER FOR ADVANCED PACKAGING CO LTD (CN)
NAT CENTER FOR ADVANCED PACKAGING CO LTD (CN)
International Classes:
H01L23/66; H01Q1/22
Foreign References:
| CN107437536A | 2017-12-05 | |||
| CN109103568A | 2018-12-28 | |||
| CN110943054A | 2020-03-31 | |||
| CN109411434A | 2019-03-01 | |||
| US20190355679A1 | 2019-11-21 |
Attorney, Agent or Firm:
SHANGHAI ZHI-SHENG INTELLECTUAL PROPERTY OFFICE (CN)
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