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Patent Searching and Data


Title:
MULTI-CHIP PACKAGE WITH OFFSET 3D STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/209460
Kind Code:
A3
Abstract:
Various semiconductor chip devices and methods of manufacturing the same are disclosed. In one aspect, a semiconductor chip device is provided that has a reconstituted semiconductor chip package (115) that includes an interposer (125) that has a first side and a second and opposite side and a metallization stack (145) on the first side, a first semiconductor chip (25) on the metallization stack and at least partially encased by a dielectric layer (165) on the metallization stack, and plural semiconductor chips (40, 45) positioned over and at least partially laterally overlapping the first semiconductor chip.

Inventors:
BHAGAVAT, Milind, S. (2485 Augustine Drive, Santa Clara, CA, 95054, US)
AGARWAL, Rahul (2485 Augustine Drive, Santa Clara, CA, 95054, US)
LOH, Gabriel, H. (2002 - 156th Ave. Ne, Suite 300Bellevue, WA, 98007, US)
Application Number:
US2019/024826
Publication Date:
December 05, 2019
Filing Date:
March 29, 2019
Export Citation:
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Assignee:
ADVANCED MICRO DEVICES, INC. (2485 Augustine Drive, Santa Clara, CA, 95054, US)
International Classes:
H01L25/065; H01L23/00; H01L23/498; H01L25/07
Foreign References:
US20140203457A12014-07-24
CN106558574A2017-04-05
US20170018534A12017-01-19
US20150255427A12015-09-10
US20110084373A12011-04-14
Attorney, Agent or Firm:
HONEYCUTT, Timothy, Mark (37713 Parkway Oaks Lane, Magnolia, TX, 77355, US)
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