Title:
MULTI-COMPONENT CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/282172
Kind Code:
A1
Abstract:
Provided is a multi-component curable composition containing an agent A and an agent B. Agent A contains a polyoxyalkylene-based polymer (A) having an average of more than one reactive silicon group, represented by general formula (1) below, at one terminal position. Agent B contains a reactive silicon group-containing polyoxyalkylene-based polymer (P) and/or a plasticizer (D), an inorganic filler (E), and water (F). The percentage of the inorganic filler (E) in the total amount of the agent B is 10 wt.% or greater. -SiX3 X represents a hydroxyl group or a hydrolyzable group.
Inventors:
MIYAFUJI KIYOSHI
Application Number:
PCT/JP2022/026228
Publication Date:
January 12, 2023
Filing Date:
June 30, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08G65/336; C08K3/013; C08L71/02
Domestic Patent References:
WO2021059972A1 | 2021-04-01 | |||
WO2017057719A1 | 2017-04-06 |
Foreign References:
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JP2015105324A | 2015-06-08 | |||
JPH08283589A | 1996-10-29 | |||
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Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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