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Patent Searching and Data


Title:
MULTI-LAYER COATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/085088
Kind Code:
A1
Abstract:
The present invention forms a multi-layer coating layer with high flatness on a substrate by using a multi-layer die. Specifically, provided is a multi-layer coating device for applying a slurry to a base material simultaneously in multiple layers, wherein the device is characterized by comprising: a die having a discharge port for discharging the slurry to the base material, and a plurality of flow paths long in the width direction for supplying the slurry to the discharge port, and formed so that slurry is discharged in a layer form from the discharge port to the surface of the base material through each flow path; and a plurality of supply means for supplying the slurry to each of the plurality of flow paths. The device is also characterized in that a plurality of adjustment units for adjusting the discharge amount of the slurry from the discharge port by causing the slurry to flow out or flow in are provided in at least one of the flow paths, across the width direction.

Inventors:
WATANABE ATSUSHI (JP)
KITAJIMA KENJI (JP)
Application Number:
PCT/JP2019/039765
Publication Date:
April 30, 2020
Filing Date:
October 09, 2019
Export Citation:
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Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B05C5/02; B05C9/06; B05C11/10; H01M4/04
Domestic Patent References:
WO2018143342A12018-08-09
Foreign References:
JPH09223499A1997-08-26
JP2015097198A2015-05-21
JP2002355595A2002-12-10
JP2013004400A2013-01-07
JP2015153527A2015-08-24
JP2014160564A2014-09-04
JP2014146592A2014-08-14
JP2003170097A2003-06-17
JP2013069645A2013-04-18
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