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Patent Searching and Data


Title:
MULTI-LAYER CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/047009
Kind Code:
A1
Abstract:
Disclosed in the present invention is a manufacturing method for a multi-layer conductive film. Said method comprises: providing a substrate; preparing a first conductive layer on the substrate; coating a UV/heat dual-curing adhesive on the first conductive layer; imprinting a second mold on a second UV/heat dual-curing adhesive; curing the second UV/heat dual-curing adhesive by means of UV illumination and heating; forming a second pattern groove; and filling a conductive material in the second pattern groove to form a second conductive layer. Further disclosed in the present invention is a multi-layer conductive film, comprising a substrate, a first conductive layer provided on the substrate, and a second UV/heat dual-curing adhesive layer and a second conductive layer which are provided on the first conductive layer, the second UV/heat dual-curing adhesive layer being provided with a second pattern groove, and the second conductive layer being embedded in the second pattern groove. By means of the features of the UV/heat dual-curing adhesive, the second UV/heat curing adhesive performs curing thoroughly, enhancing the interlayer adhesive force, so that degumming and residue adhesive does not easily occur to the multi-layer conductive film, thereby ensuring the quality and usage period of a product.

Inventors:
JI LIANGLIANG (CN)
ZHOU XIAOHONG (CN)
LIU LINYUE (CN)
Application Number:
PCT/CN2019/117103
Publication Date:
March 18, 2021
Filing Date:
November 11, 2019
Export Citation:
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Assignee:
IVTOUCH CO LTD (CN)
International Classes:
G06F3/041; H01B5/14
Foreign References:
CN103208326A2013-07-17
CN101016347A2007-08-15
CN101583245A2009-11-18
CN103268780A2013-08-28
KR20140008685A2014-01-22
Attorney, Agent or Firm:
SUZHOU JINHE INTELLECTUAL PROPERTY AGENCY (SPECIAL GENERAL PARTNERSHIP) (CN)
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