Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MULTI-LAYER DIMPLED HEAT SHIELD
Document Type and Number:
WIPO Patent Application WO2006090312
Kind Code:
A3
Abstract:
A multi-layer heat shield with complementary contours or dimples formed in adjacent layers. The dimples provide contact between layers that dampen vibrations. The dimples may be formed concurrently in all layers with a stamping die. The dimples increase the heat shield's damping.

Inventors:
OXENKNECHT ERNEST (US)
Application Number:
IB2006050515W
Publication Date:
November 09, 2006
Filing Date:
February 16, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DANA CORP (US)
OXENKNECHT ERNEST (US)
International Classes:
F01N13/10; F01N13/14; F02B77/11; F02B77/13
Foreign References:
EP1316691A12003-06-04
US20040142152A12004-07-22
CA2414160A12004-06-12
US5691037A1997-11-25
US6681890B12004-01-27
US5958603A1999-09-28
US6090495A2000-07-18
US5981082A1999-11-09
Download PDF: