MULTI-LAYER FLAT PLATE ANTENNA WITH LOW-COST MATERIAL AND HIGH-CONDUCTIVITY ADDITIVE PROCESSING

Title:

MULTI-LAYER FLAT PLATE ANTENNA WITH LOW-COST MATERIAL AND HIGH-CONDUCTIVITY ADDITIVE PROCESSING

Document Type and Number:

WIPO Patent Application WO2002080302

Kind Code:

A3

Abstract:

The invention is a multi-layer printed circuit antenna and a method for developing the antenna for which a screen printing technology is used to deposit conducting material forming the circuit layout directly on low-cost dielectric material, followed by a post-processing step performed on the printed circuit to increase circuit conductivity. In one embodiment, the dielectric material used is a thin layer supported by low-loss, foam-like material for spacing between the antenna layers. In another embodiment, a thick high-density, low-cost low-loss dielectric material(40,50) acts as both the printing surface and the spacer between the antenna layers(10,20,10). The thick high-density, low-cost low-loss dielectric material(40,50) allows for saving one layer in every printed circuit. The screen printing or additive process is less expensive than its etching or substractive counterpart due to the process itself and due to the lower cost of materials.

Inventors:

KOHLS ERIC CHRISTOPHER (US)

Application Number:

PCT/US2002/006673

Publication Date:

December 12, 2002

Filing Date:

March 29, 2002

Export Citation:

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Assignee:

COMSAT CORP (US)
ZAGHLOUL AMIR IBRAHIM (US)
KOHLS ERIC CHRISTOPHER (US)

International Classes:

H01Q1/38; H01Q21/00; H05K1/02; H05K1/09; H05K1/16; (IPC1-7): H01Q1/38; H01B1/22

Foreign References:

US4829309A	1989-05-09
US6165386A	2000-12-26
US5708679A	1998-01-13

Other References: