Title:
MULTI-LAYER HEAT SPREADER ASSEMBLY WITH ISOLATED CONVECTIVE FINS
Document Type and Number:
WIPO Patent Application WO/2015/023447
Kind Code:
A3
Abstract:
An assembly of two or more heatspreaders is attached to a printed circuit board in a compact electronic enclosure. The heatspreaders include fins which assist in convecting heat out of the enclosure through vents. The printed circuit board is shielded from the outer case by the heatspreaders.
Inventors:
RITTER DARIN BRADLEY (US)
ANDERSON MARK ROBERT (US)
ANDERSON MARK ROBERT (US)
Application Number:
PCT/US2014/049110
Publication Date:
October 29, 2015
Filing Date:
July 31, 2014
Export Citation:
Assignee:
THOMSON LICENSING (FR)
International Classes:
F28F3/04
Foreign References:
| US20110194253A1 | 2011-08-11 | |||
| US20090236626A1 | 2009-09-24 | |||
| US20100315252A1 | 2010-12-16 | |||
| US7588074B1 | 2009-09-15 | |||
| US20100008025A1 | 2010-01-14 | |||
| US20130063895A1 | 2013-03-14 | |||
| US20100097767A1 | 2010-04-22 |
Other References:
See also references of EP 3033578A4
Attorney, Agent or Firm:
SHEDD, Robert D. et al. (2 Independence Way Suite #20, Princeton New Jersey, US)
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