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Patent Searching and Data


Title:
MULTI-LAYER MEMS SPRING PIN
Document Type and Number:
WIPO Patent Application WO/2020/213899
Kind Code:
A1
Abstract:
A three-layer MEMS spring pin of the present invention comprises: a lower-layer spring pin, in which a lower-layer wave is connected between a lower-layer top plunger and a lower-layer bottom plunger; an upper-layer spring pin, in which an upper-layer wave is connected between an upper-layer top plunger and an upper-layer bottom plunger; a middle-layer top tip interposed between the upper-layer top plunger and the lower-layer top plunger; and a middle-layer bottom tip interposed between the upper-layer bottom plunger and the lower-layer bottom plunger. According to the configuration of the present invention as described above, the effects of preventing bending, stabilizing a stroke due to the multi-layer spring, and enhancing contact characteristics due to the multi-layer plunger are expected.

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Inventors:
JUN JIN KOOK (KR)
CHA SANG HOON (KR)
JEONG CHANG MO (KR)
Application Number:
PCT/KR2020/004957
Publication Date:
October 22, 2020
Filing Date:
April 13, 2020
Export Citation:
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Assignee:
OKINS ELECTRONICS CO LTD (KR)
International Classes:
G01R1/067; G01R3/00; G01R31/28
Foreign References:
KR20180095315A2018-08-27
KR20180038032A2018-04-13
KR20170029146A2017-03-15
KR101799309B12017-12-20
JP2015045649A2015-03-12
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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