Title:
MULTI-LAYER POLISHING PAD MATERIAL FOR CMP
Document Type and Number:
WIPO Patent Application WO2005000527
Kind Code:
A3
Abstract:
The invention is directed to a multi-layer polishing pad (10) for chemical-mechanical polishing comprising a polishing layer (12) and a bottom layer (14), wherein the polishing layer and bottom layer are joined together without the use of an adhesive. The invention is also directed to a polishing pad comprising an optically transmissive multi-layer polishing pad material, wherein the layers of the polishing pad material are joined together without the use of an adhesive.
Inventors:
PRASAD ABANESHWAR
SEVILLA ROLAND K
LACY MICHAEL S
SEVILLA ROLAND K
LACY MICHAEL S
Application Number:
PCT/US2004/017564
Publication Date:
June 02, 2005
Filing Date:
June 03, 2004
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORP (US)
International Classes:
B24B7/30; B24B37/20; B24D3/32; B24D13/14; (IPC1-7): B24D3/32; B24B37/04; B24D13/14
Domestic Patent References:
| WO2001045900A1 | 2001-06-28 |
Foreign References:
| US20020026752A1 | 2002-03-07 |
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