Title:
MULTI-LAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/148271
Kind Code:
A1
Abstract:
Provided is a multi-layer structure obtained by laminating a thermoplastic resin layer of a material other than an ethylene-vinyl ester saponified copolymer to at least one surface of a layer that contains an ethylene-vinyl ester saponified copolymer, with an adhesive resin layer interposed therebetween. The thickness (X) of the layer interface at the lamination interface between the adhesive resin layer and the layer containing the ethylene-vinyl ester saponified copolymer in the multi-layer structure is 50-400 nm per interface surface. Alternatively, the thickening rate at the lamination interface between the adhesive resin layer and the layer containing the ethylene-vinyl ester saponified copolymer is 0.1-8% per interface surface. The multi-layer structure so obtained therefore has fewer defects in appearance even when subjected to multi-layer co-extrusion molding, while retaining long-run molding properties.
Inventors:
KOMURO RYOHEI (JP)
Application Number:
PCT/JP2016/058652
Publication Date:
September 22, 2016
Filing Date:
March 18, 2016
Export Citation:
Assignee:
NIPPON SYNTHETIC CHEM IND CO LTD (JP)
International Classes:
B32B27/28; B29C48/16; B32B27/18; B65D65/40; B65D81/24; C08K5/098; C08L29/04; B29C48/08; B29C48/21; B29K29/00; B29L9/00
Domestic Patent References:
| WO2015041135A1 | 2015-03-26 |
Foreign References:
| JP2001348017A | 2001-12-18 | |||
| JP2002060496A | 2002-02-26 | |||
| JP2003073506A | 2003-03-12 |
Other References:
See also references of EP 3272525A4
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
Masahiko Nishifuji (JP)
Masahiko Nishifuji (JP)
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