Title:
MULTI-LAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/054282
Kind Code:
A1
Abstract:
A multi-layer structure according to the present invention comprises a support body made of resin, an adhesive layer laminated on the support body, a metal layer laminated on the adhesive layer, and a glass layer laminated on the metal layer. The thickness of the glass layer is 10-300 µm, and when the elastic modulus of the adhesive layer at 60ºC is denoted by x [MPa], and the amount of moisture contained in the support body is denoted by y [µg/cm2], y ≤ 3333.3x is satisfied.
Inventors:
WATANABE RYO (JP)
INAGAKI JUNICHI (JP)
SATO KEISUKE (JP)
INAGAKI JUNICHI (JP)
SATO KEISUKE (JP)
Application Number:
PCT/JP2022/035775
Publication Date:
April 06, 2023
Filing Date:
September 26, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B15/08; B32B17/04; G02B5/08
Domestic Patent References:
| WO2012023347A1 | 2012-02-23 |
Foreign References:
| JP2015210335A | 2015-11-24 | |||
| JP2011026449A | 2011-02-10 | |||
| JP2017096987A | 2017-06-01 | |||
| JP2015125167A | 2015-07-06 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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