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Patent Searching and Data


Title:
MULTI-LAYER WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/155418
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a multi-layer wiring substrate that enables suppressing inter-layer misalignment, and restraining transmission loss of an electric signal by using an adhesive layer having a superior peel strength when a fluorine resin substrate is used. Provided is a multi-layer wiring substrate 1 which comprises: a fluorine resin substrate 30 having a conductor pattern 20 formed at least on one surface thereof; and an adhesive layer 10 for adhering the fluorine resin substrate 30, wherein the adhesive layer 10 contains a cured product of a thermosetting resin, and has a fracture elongation of 20-300%.

Inventors:
YOSHIDA MASAKI (JP)
OHASHI SATOKO (JP)
Application Number:
PCT/JP2018/005932
Publication Date:
August 30, 2018
Filing Date:
February 20, 2018
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
H05K3/46; B32B15/082; C09J7/20; C09J11/04; C09J11/06; C09J201/00; H01L23/12
Foreign References:
JP2011011456A2011-01-20
JP2016124982A2016-07-11
JP2006059865A2006-03-02
JP2012243923A2012-12-10
JP2008056820A2008-03-13
JP2005268365A2005-09-29
JP2007098692A2007-04-19
JP2005268365A2005-09-29
JPH07323501A1995-12-12
JP2004059644A2004-02-26
Other References:
See also references of EP 3589093A4
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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