Title:
MULTI-LAYERED FILM AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2019/069759
Kind Code:
A1
Abstract:
Provided are: a multi-layered film which is at least provided with a sealant layer constituting a surface layer, the sealant layer 2 comprising at least a first resin having a melting point of 80-110°C and a second resin having a melting point of 130-200°C; and a package which is provided with said multi-layered film and a polyethylene nonwoven fabric, wherein at least a part of the sealant layer of the multi-layered film is heat-sealed to the surface of the nonwoven fabric.
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Inventors:
SASAKI KENTA (JP)
Application Number:
PCT/JP2018/035638
Publication Date:
April 11, 2019
Filing Date:
September 26, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B27/00; B32B27/28; B32B27/32; B65D65/40; C08L23/04; C08L23/10
Foreign References:
| JP2006256144A | 2006-09-28 | |||
| JP2003001768A | 2003-01-08 | |||
| JP2007276323A | 2007-10-25 | |||
| JP2012144015A | 2012-08-02 | |||
| JP2012076796A | 2012-04-19 | |||
| JP2010194781A | 2010-09-09 | |||
| JP2005307112A | 2005-11-04 | |||
| JP2005263277A | 2005-09-29 | |||
| JP2004230884A | 2004-08-19 | |||
| JP2001315837A | 2001-11-13 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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