Title:
MULTI-PIECE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2010/058763
Kind Code:
A1
Abstract:
A method for manufacturing a multi-piece substrate includes: a step of forming a multi-piece substrate by bonding a second frame section, i.e., the section other than a first frame section, on the first frame section of a substrate main body section, which has the first frame section, i.e., a part of the frame section, and a piece section connected to the first frame section; a step of mounting electronic components on a plurality of piece sections; a step of removing the piece sections from the frame section; a step (step (S21)) of removing the second frame section left bonded on the first frame section; and a step (step (S25)) of bonding together the removed second frame section and the first frame section of other substrate main body section.
Inventors:
HASEGAWA YASUSHI (JP)
Application Number:
PCT/JP2009/069479
Publication Date:
May 27, 2010
Filing Date:
November 17, 2009
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
HASEGAWA YASUSHI (JP)
HASEGAWA YASUSHI (JP)
International Classes:
H05K3/00; H05K1/02
Foreign References:
| JP2005019693A | 2005-01-20 | |||
| JPH05206590A | 1993-08-13 | |||
| JPS6413178U | 1989-01-24 | |||
| JP2003115657A | 2003-04-18 | |||
| JP2006286949A | 2006-10-19 | |||
| JPH0593950A | 1993-04-16 | |||
| JP2000252605A | 2000-09-14 |
Attorney, Agent or Firm:
KIMURA MITSURU (JP)
Mitsuru Kimura (JP)
Mitsuru Kimura (JP)
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