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Patent Searching and Data


Title:
MULTI-WIRE SAW DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/077790
Kind Code:
A1
Abstract:
[Problem] To provide a multi-wire saw device that is capable of reducing kerf loss while suppressing breakage of a slicing wire material. [Solution] A multi-wire saw device 10 includes a wire saw 30 that is repeatedly laid between groove-provided rollers 12A, 12B so as to form a wire-saw row 30L. The wire saw 30 bridges the two rollers 30A, 30B in a state of being twisted so as to bring a first main surface 30A into contact with the groove-provided roller 12A and a second main surface 30B into contact with the groove-provided roller 12B, and an end surface 32A to which abrasive grains 34A-34C have been fixed is pressed against a silicon ingot 20.

Inventors:
INOUE Hiroki (5-16 Shimizudani-cho, Tennoji-k, Osaka-shi Osaka 11, 〒5430011, JP)
KONDO Takayuki (5-16 Shimizudani-cho, Tennoji-k, Osaka-shi Osaka 11, 〒5430011, JP)
Application Number:
JP2018/019342
Publication Date:
April 25, 2019
Filing Date:
May 18, 2018
Export Citation:
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Assignee:
TKX CORPORATION (5-16, Shimizudani-cho Tennoji-k, Osaka-shi Osaka 11, 〒5430011, JP)
International Classes:
H01L21/304; B24B27/06; B28D5/04
Domestic Patent References:
WO2014063910A12014-05-01
Foreign References:
JPH09193143A1997-07-29
JP2003231063A2003-08-19
JP2010167509A2010-08-05
JP2008114318A2008-05-22
JP2007044794A2007-02-22
JP2011098423A2011-05-19
JP2011079073A2011-04-21
JP2010110866A2010-05-20
Attorney, Agent or Firm:
KUSUMOTO Takayoshi et al. (KUSUMOTO PATENTS & TRADEMARKS, Omi-Tetsudo Bldg. 5F, 4-7, Awazu-cho, Otsu-sh, Shiga 32, 〒5200832, JP)
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