Title:
MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/013487
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a multicomponent curable composition capable of providing a cured product having excellent tensile properties and tear strength. Provided is a multicomponent curable composition including: a component A, which includes a polyoxyalkylene polymer having a specific reactive silicon group (A), an epoxy resin curing agent (B), an aminosilane (C), and a mercaptan compound (D); and a component B, which includes an epoxy resin (E). The multicomponent curable composition includes a hydroxyl group-containing polyoxyalkylene polymer (F) in the component A and/or the component B.
Inventors:
KAMIYAMA HIROSHI (JP)
Application Number:
PCT/JP2022/028867
Publication Date:
February 09, 2023
Filing Date:
July 27, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L71/02; C08G59/66; C08G65/336; C09K3/10
Domestic Patent References:
| WO2006075482A1 | 2006-07-20 | |||
| WO2021059972A1 | 2021-04-01 | |||
| WO2021024817A1 | 2021-02-11 | |||
| WO2020170908A1 | 2020-08-27 | |||
| WO2019069866A1 | 2019-04-11 |
Foreign References:
| JP2002309077A | 2002-10-23 | |||
| JP2011256284A | 2011-12-22 | |||
| JPH09279047A | 1997-10-28 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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