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Title:
MULTIFUNCTIONAL SELF-SUSTAINED HOSTING APPARATUS AND RELATED BIDIRECTIONAL OPTICAL SUB ASSEMBLY BASED ON PHOTONIC INTEGRATED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2022/254290
Kind Code:
A1
Abstract:
The invention refers to a multifunctional self-sustained hosting apparatus for photonic integrated circuit and/or related chipset system packaging comprising a processed wafer (1); and at least a cavity (2), wherein said cavity (2) is configured to receive a chipset or an optical lens; and at least a V-groove (3), which is configured for receiving at least an in/out optical fiber and optically align said optical fiber with an optical endface of a chipset. The invention also refers to a bidirectional optical sub assembly based on photonic integrated circuit, which comprises said hosting apparatus. The hosting apparatus enables PIC&IC co-packaging allowing to answer current and future requirements in diverse PIC applications. The apparatus provides electrical interconnections using direct-current lines and radio frequency lines, and may host a plurality of chipsets with different dimensions and orientations, providing a high-precision optical coupling between arrays of optical fibers and optical endface of chipsets.

Inventors:
RUIVO RODRIGUES FRANCISCO MANUEL (PT)
PEREIRA BASTOS NUNO RICARDO (PT)
BARBOSA NETO HUGO DANIEL (PT)
SHEIKHNEJAD YAHYA (IR)
LOPES SILVA PEDRO NUNO (PT)
JESUS TEIXEIRA ANTÓNIO LUÍS (PT)
Application Number:
PCT/IB2022/054917
Publication Date:
December 08, 2022
Filing Date:
May 25, 2022
Export Citation:
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Assignee:
PICADVANCED S A (PT)
International Classes:
G02B6/42
Domestic Patent References:
WO2020077285A12020-04-16
Foreign References:
US6502999B12003-01-07
US20180136401A12018-05-17
US5026138A1991-06-25
US10438894B12019-10-08
US20050018969A12005-01-27
US20030137022A12003-07-24
US7031576B22006-04-18
US6888989B12005-05-03
US20190285813A12019-09-19
Other References:
MIRELES ET AL: "Optical fiber packaging for MEMS interfacing", ALGORITHMS AND TECHNOLOGIES FOR MULTISPECTRAL, HYPERSPECTRAL, AND ULTRASPECTRAL IMAGERY XIX - PROCEEDINGS OF SPIE, vol. 7204, 12 February 2009 (2009-02-12), US, pages 720405, XP055944523, ISSN: 0277-786X, ISBN: 978-1-5106-4548-6, DOI: 10.1117/12.815170
Attorney, Agent or Firm:
INVENTA INTERNATIONAL S.A. (PT)
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