Title:
MULTIFUNCTIONAL SELF-SUSTAINED HOSTING APPARATUS AND RELATED BIDIRECTIONAL OPTICAL SUB ASSEMBLY BASED ON PHOTONIC INTEGRATED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2022/254290
Kind Code:
A1
Abstract:
The invention refers to a multifunctional self-sustained hosting apparatus for photonic integrated circuit and/or related chipset system packaging comprising a processed wafer (1); and at least a cavity (2), wherein said cavity (2) is configured to receive a chipset or an optical lens; and at least a V-groove (3), which is configured for receiving at least an in/out optical fiber and optically align said optical fiber with an optical endface of a chipset. The invention also refers to a bidirectional optical sub assembly based on photonic integrated circuit, which comprises said hosting apparatus. The hosting apparatus enables PIC&IC co-packaging allowing to answer current and future requirements in diverse PIC applications. The apparatus provides electrical interconnections using direct-current lines and radio frequency lines, and may host a plurality of chipsets with different dimensions and orientations, providing a high-precision optical coupling between arrays of optical fibers and optical endface of chipsets.
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Inventors:
RUIVO RODRIGUES FRANCISCO MANUEL (PT)
PEREIRA BASTOS NUNO RICARDO (PT)
BARBOSA NETO HUGO DANIEL (PT)
SHEIKHNEJAD YAHYA (IR)
LOPES SILVA PEDRO NUNO (PT)
JESUS TEIXEIRA ANTÓNIO LUÍS (PT)
PEREIRA BASTOS NUNO RICARDO (PT)
BARBOSA NETO HUGO DANIEL (PT)
SHEIKHNEJAD YAHYA (IR)
LOPES SILVA PEDRO NUNO (PT)
JESUS TEIXEIRA ANTÓNIO LUÍS (PT)
Application Number:
PCT/IB2022/054917
Publication Date:
December 08, 2022
Filing Date:
May 25, 2022
Export Citation:
Assignee:
PICADVANCED S A (PT)
International Classes:
G02B6/42
Domestic Patent References:
WO2020077285A1 | 2020-04-16 |
Foreign References:
US6502999B1 | 2003-01-07 | |||
US20180136401A1 | 2018-05-17 | |||
US5026138A | 1991-06-25 | |||
US10438894B1 | 2019-10-08 | |||
US20050018969A1 | 2005-01-27 | |||
US20030137022A1 | 2003-07-24 | |||
US7031576B2 | 2006-04-18 | |||
US6888989B1 | 2005-05-03 | |||
US20190285813A1 | 2019-09-19 |
Other References:
MIRELES ET AL: "Optical fiber packaging for MEMS interfacing", ALGORITHMS AND TECHNOLOGIES FOR MULTISPECTRAL, HYPERSPECTRAL, AND ULTRASPECTRAL IMAGERY XIX - PROCEEDINGS OF SPIE, vol. 7204, 12 February 2009 (2009-02-12), US, pages 720405, XP055944523, ISSN: 0277-786X, ISBN: 978-1-5106-4548-6, DOI: 10.1117/12.815170
Attorney, Agent or Firm:
INVENTA INTERNATIONAL S.A. (PT)
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