Title:
MULTIFUNCTIONAL VINYL AROMATIC COPOLYMER
Document Type and Number:
WIPO Patent Application WO/2023/189949
Kind Code:
A1
Abstract:
One purpose of the present disclosure is to provide: a multifunctional vinyl aromatic copolymer which enables the achievement of a prepreg that has excellent dielectric characteristics and excellent heat resistance, while having fewer voids, a laminate that has good appearance and high interlayer peel strength, and the like; and a curable resin composition and the like which contain this multifunctional vinyl aromatic copolymer. The present disclosure provides a multifunctional vinyl aromatic copolymer which has a structural unit derived from a divinyl aromatic compound and a structural unit derived from a monovinyl aromatic compound. The proportion of m-forms of the divinyl aromatic compound is 60 mol% or more; and the molecular weight distribution dispersity (Mw/Mn) expressed by the ratio of the weight average molecular weight to the number average molecular weight of the multifunctional vinyl aromatic copolymer is 1 to 2.5.
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Inventors:
SUEMITSU CHIHIRO (JP)
Application Number:
PCT/JP2023/011253
Publication Date:
October 05, 2023
Filing Date:
March 22, 2023
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C08F212/00; B32B15/08; C08F2/44; C08K3/013; C08K5/3492; C08L25/08; C08L71/12
Domestic Patent References:
WO2018181842A1 | 2018-10-04 | |||
WO2020262371A1 | 2020-12-30 |
Foreign References:
JP2008239781A | 2008-10-09 | |||
JPH05214111A | 1993-08-24 | |||
JPS59161409A | 1984-09-12 | |||
JPH0517533A | 1993-01-26 | |||
JP2004244638A | 2004-09-02 | |||
JP2018039995A | 2018-03-15 |
Other References:
MATSUMOTO AKIRA, OE HIROAKI, AOTA HIROYUKI: "Degradation of Ultrahigh Molecular Weight Poly(styrene-co-m-divinylbenzene)s as Network-Polymer Precursors in SEC Columns", POLYMER JOURNAL, NATURE PUBLISHING GROUP UK, LONDON, vol. 34, no. 3, 1 March 2002 (2002-03-01), London , pages 242 - 245, XP093097096, ISSN: 0032-3896, DOI: 10.1295/polymj.34.242
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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