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Patent Searching and Data


Title:
MULTILAYER BOARD INCORPORATING LAMINATED MAGNETIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2005/031766
Kind Code:
A1
Abstract:
A multilayer board (10A) comprising of a laminated transformer (10), a thick film component sheet (30) on which thick film components are formed, and a wiring sheet (50) on which a wiring pattern is formed. Since the multilayer board (10A) incorporates the laminated transformer (10), packaging of the laminated transformer (10) is eliminated and wiring between the laminated transformer (10) and other components is minimized.

Inventors:
SUZUKI YUKIHARU (JP)
KOBAYASHI TOSHIHIKO (JP)
MIZOGUCHI TOSHIMI (JP)
Application Number:
PCT/JP2003/012433
Publication Date:
April 07, 2005
Filing Date:
September 29, 2003
Export Citation:
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Assignee:
TAMURA SEISAKUSHO KK (JP)
SUZUKI YUKIHARU (JP)
KOBAYASHI TOSHIHIKO (JP)
MIZOGUCHI TOSHIMI (JP)
International Classes:
H01F17/00; H01F27/28; H05K1/16; (IPC1-7): H01F17/00
Foreign References:
JP2003197426A2003-07-11
JPH04239109A1992-08-27
JPS62176111A1987-08-01
JPS62152111A1987-07-07
JP2003272920A2003-09-26
Attorney, Agent or Firm:
Kiuchi, Mitsuharu (Toranomon-Yoshiara Bldg. 6-13, Nishi-Shinbashi 1-chom, Minato-ku Tokyo, JP)
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