Title:
MULTILAYER BOARD, INTERPOSER, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/082714
Kind Code:
A1
Abstract:
This multilayer board (301) is provided with: an element body (10) having a first main surface (MS1); first external electrodes (external electrodes (P11, P12)) formed on the first main surface (MS1) and formed of a metal foil; first interlayer connection conductors (LC11, LC12); and second interlayer connection conductors (LC21, LC22) which are formed of metal and have a higher conductivity than the first interlayer conductors (LC11, LC12). The element body (10) is formed by laminating a plurality of insulating substrate layers (11, 12, 13, 14, 15). The first interlayer connection conductors (LC11, LC12) are connected to the first external electrodes and formed on an insulating substrate layer (11) on which at least the first external electrodes are formed. The second interlayer connection conductors (LC21, LC22) are arranged inside the element body (10) and connected to the first external electrodes through the first interlayer connection conductors (LC11, LC12).
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Inventors:
KOYAMA HIROMASA (JP)
TAKADA RYOSUKE (JP)
KASUYA ATSUSHI (JP)
TAKADA RYOSUKE (JP)
KASUYA ATSUSHI (JP)
Application Number:
PCT/JP2018/038278
Publication Date:
May 02, 2019
Filing Date:
October 15, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/11; H05K3/46
Foreign References:
| JP2014146650A | 2014-08-14 | |||
| JPH08236979A | 1996-09-13 | |||
| JP2001015929A | 2001-01-19 | |||
| JP2007088356A | 2007-04-05 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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