Title:
MULTILAYER BOARD
Document Type and Number:
WIPO Patent Application WO/2023/085177
Kind Code:
A1
Abstract:
A plurality of first linear conductors are positioned above signal conductors. A plurality of second linear conductors are positioned below the signal conductors. The plurality of first linear conductors and the plurality of second linear conductors cross the signal conductors when viewed in the vertical direction. The plurality of second linear conductors extend along the plurality of first linear conductors when viewed in the vertical direction. When viewed in the vertical direction, at least a portion of any one second linear conductor among the plurality of second linear conductors overlaps with each of a plurality of first regions positioned between two adjacent first linear conductors. When viewed in the vertical direction, at least a portion of any one first linear conductor among the plurality of first linear conductors overlaps with each of a plurality of second regions positioned between two adjacent second linear conductors.
Inventors:
NISHIO KOSUKE (JP)
YOSUI KUNIAKI (JP)
YOSUI KUNIAKI (JP)
Application Number:
PCT/JP2022/040905
Publication Date:
May 19, 2023
Filing Date:
November 01, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H01P3/02
Domestic Patent References:
| WO2011007660A1 | 2011-01-20 |
Foreign References:
| US20150055307A1 | 2015-02-26 | |||
| US20060071739A1 | 2006-04-06 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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