Title:
MULTILAYER BODY, COMPOSITION, AND KIT FOR FORMING MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2020/195995
Kind Code:
A1
Abstract:
A multilayer body which sequentially comprises a base material, an organic layer, a protective layer and a photosensitive layer in this order, and which is configured such that: the protective layer contains a resin; the resin has a branch part and a molecular chain that is bonded to the branch part; the molecular chain has at least one repeating unit that is selected from among repeating units represented by one of formulae (1-1) to (5-1); the photosensitive layer is subjected to a development process that uses a developer liquid; and the protective layer is subjected to a removal process that uses a remover liquid. A composition that is used for the formation of a protective layer or a photosensitive layer, which is contained in the above-described multilayer body; and a kit for forming a multilayer body, which is used for the formation of the above-described multilayer body.
In the formulae, R11 represents a hydrogen atom or a methyl group; R21 represents a hydrogen atom or a methyl group; each of R31-R33 independently represents a substituent or a hydrogen atom; each of R41-R49 independently represents a substituent or a hydrogen atom; and each of R51-R54 independently represents a hydrogen atom or a substituent.
Inventors:
NAKAMURA ATSUSHI (JP)
Application Number:
PCT/JP2020/011329
Publication Date:
October 01, 2020
Filing Date:
March 16, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F251/00; B32B7/023; C08F261/04; C08F283/06; G03F7/11; G03F7/26
Domestic Patent References:
| WO2016175220A1 | 2016-11-03 |
Foreign References:
| JP2015194674A | 2015-11-05 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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