Title:
MULTILAYER BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/238694
Kind Code:
A1
Abstract:
The present invention provides a multilayer body which comprises: a base material; a first heat conductive layer which is arranged on the base material and contains a curable component, a curing agent that cures the curable component, first heat conductive particles, and low-melting-point metal particles; and a second heat conductive layer which is arranged on the first heat conductive layer and contains a curable component, a curing agent that cures the curable component, second heat conductive particles, and low-melting-point metal particles. Some of the first heat conductive particles in the first heat conductive layer and some of the second heat conductive particles in the second heat conductive layer are in contact with each other; the volume average particle diameter of the first heat conductive particles is smaller than the volume average particle diameter of the second heat conductive particles; and the base material contains at least one substance that is selected from among silicon, aluminum, tungsten, molybdenum, glass, a mold resin, a stainless steel and a ceramic.
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Inventors:
ZHAO YIJING (JP)
SHIBUYA HIROKI (JP)
IWATA YUKI (JP)
NISHIO TAKESHI (JP)
NAGASHIMA MINORU (JP)
SHIBUYA HIROKI (JP)
IWATA YUKI (JP)
NISHIO TAKESHI (JP)
NAGASHIMA MINORU (JP)
Application Number:
PCT/JP2023/019593
Publication Date:
December 14, 2023
Filing Date:
May 25, 2023
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B32B27/18; B32B7/027; H01L23/36
Domestic Patent References:
| WO2013094613A1 | 2013-06-27 | |||
| WO2019065146A1 | 2019-04-04 | |||
| WO2022075411A1 | 2022-04-14 | |||
| WO2015146349A1 | 2015-10-01 |
Foreign References:
| JP2020080345A | 2020-05-28 | |||
| US20190092994A1 | 2019-03-28 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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