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Title:
MULTILAYER BODY AND PACKAGING CONTAINER FORMED OF MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2021/200816
Kind Code:
A1
Abstract:
A multilayer body according to the present disclosure is sequentially provided with at least a first sealant layer, a vapor deposition film and a second sealant layer. The first sealant layer is provided with at least a polyethylene resin layer and a surface resin layer; the vapor deposition film is provided on the surface resin layer of the first sealant layer; the second sealant layer is configured from a polyethylene resin; and the surface resin layer of the first sealant layer contains a resin material that has a melting point of 150°C or more.

Inventors:
YAMADA KENICHI (JP)
HAYASHI KAEKO (JP)
KAWAKITA NORIAKI (JP)
SUZUKI YOSHIHIKO (JP)
Application Number:
PCT/JP2021/013269
Publication Date:
October 07, 2021
Filing Date:
March 29, 2021
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B27/32; B32B1/02; B32B9/00; B32B15/085; B65D35/10; B65D65/40; C08L23/02; C08L23/04; C08L53/00
Domestic Patent References:
WO2019189092A12019-10-03
WO2021054349A12021-03-25
WO2019087960A12019-05-09
Foreign References:
JP2008162598A2008-07-17
JP2006306440A2006-11-09
JP2020011415A2020-01-23
JP2018511504A2018-04-26
JPS56144754U1981-10-31
JP2020063340A2020-04-23
JP2020065043A2020-04-23
JP2020065053A2020-04-23
JP2020065071A2020-04-23
JP2020065082A2020-04-23
JP2011214089A2011-10-27
JP2012076292A2012-04-19
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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