MULTILAYER BODY FOR PREVENTING WARP OF CURED SEALED BODY AND METHOD FOR PRODUCING CURED SEALED BODY

WIPO Patent Application WO/2019/187249

A1

A multilayer body for preventing warp of a cured sealed body, which comprises a curable resin layer (I) that contains a thermosetting resin layer (X1) and a support layer (II) that supports the curable resin layer (I), and which is configured such that: the curable resin layer (I) has an adhesive surface that exhibits adhesive properties; the support layer (II) comprises a base material (Y) and an adhesive layer (V); at least one of the base material (Y) and the adhesive layer (V) contains thermally expandable particles; the curable resin layer (I), the adhesive layer (V) and the base material (Y) are sequentially arranged in this order; the adhesive surface of the curable resin layer (I) is arranged on the reverse side of the adhesive layer (V) side; the lowest curing temperature (T1), at which curing of the curable resin layer (I) is completed within 2 hours, thereby forming a cured resin layer (I'), is lower than the foaming initiation temperature (T2) of the thermally expandable particles; and an object to be sealed is sealed by means of the adhesive surface of the curable resin layer (I).

JP3957905	MULTILAYER ADHESIVE TAPE
JP2011165967	SOLAR CELL BACKSHEET AND SOLAR CELL MODULE
JP6667671	Dicing film base material and dicing film

KOMA YOSUKE (JP)
SATO AKINORI (JP)
AKUTSU TAKASHI (JP)
KAKIUCHI YASUHIKO (JP)
OKAMOTO NAOYA (JP)
YAMADA TADATOMO (JP)
NAKAYAMA TAKEHITO (JP)

PCT/JP2018/036813

October 03, 2019

October 02, 2018

Click for automatic bibliography generation  

LINTEC CORP (JP)

C09J7/29; B32B27/20; C09J7/35; C09J7/38; C09J11/06; C09J11/08; C09J201/00

JP2017092335A	2017-05-25
JP2005255829A	2005-09-22

OHTANI, Tamotsu et al. (JP)

View/Download PDF      PDF Help

Previous Patent: WARPAGE PREVENTION LAMINATE FOR CURED SEALING BODY AND METHOD FOR PRODUCING CURED SEALING BODY

Next Patent: CO ANODE, AND CO ELECTROPLATING METHOD USING CO ANODE