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Title:
MULTILAYER BODY, WATER-SOLUBLE RESIN COMPOSITION, AND KIT
Document Type and Number:
WIPO Patent Application WO/2019/167914
Kind Code:
A1
Abstract:
The present invention provides a multilayer body which has a member and a water-soluble resin layer that is on the surface of the member, and which is configured such that: the water-soluble resin layer is dissolved at a rate of 0.1-3.0 μm/second if immersed in water at 25°C; the water-soluble resin layer is formed from a water-soluble resin composition that contains a water-soluble resin and a surfactant that contains an acetylene group; and the water-soluble resin composition has a static contact angle of 69° or less with respect to the member. The present invention also provides a water-soluble resin composition and a kit.

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Inventors:
MASUDA SEIYA (JP)
Application Number:
PCT/JP2019/007194
Publication Date:
September 06, 2019
Filing Date:
February 26, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/11; B32B27/18; B32B27/30; C08F220/10; C08L29/04; C08L39/06; C08L101/14; G03F7/20; G03F7/32
Domestic Patent References:
WO2016175220A12016-11-03
Foreign References:
JP2015087613A2015-05-07
JP2015194674A2015-11-05
JP2014081528A2014-05-08
JP2014174329A2014-09-22
JP2007298633A2007-11-15
US20070166647A12007-07-19
Attorney, Agent or Firm:
SIKS & CO. (JP)
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