Title:
MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2020/105535
Kind Code:
A1
Abstract:
The present invention provides a multilayer body which is able to be suppressed in decrease in the releasing function of a release layer in either case where the multilayer body is subjected to a heat treatment under low temperature conditions or under high temperature conditions. This multilayer body is provided with: a carrier; a close adhesion layer which is arranged on the carrier and contains a metal M1 that has a negative standard electrode potential; a release promoting layer which is arranged on a surface of the close adhesion layer, said surface being on the reverse side of the carrier-side surface, and which contains a metal M2 (M2 is a metal other than alkali metals and alkaline earth metals); a release layer which is arranged on a surface of the release promoting layer, said surface being on the reverse side of the close adhesion layer-side surface; and a metal layer which is arranged on a surface of the release layer, said surface being on the reverse side of the release promoting layer-side surface. This multilayer body is configured such that the ratio of the thickness T2 of the release promoting layer to the thickness T1 of the close adhesion layer, namely T2/T1 is more than 1 but 20 or less.
Inventors:
ISHII RINTARO (JP)
YANAI TAKENORI (JP)
MATSUURA YOSHINORI (JP)
YANAI TAKENORI (JP)
MATSUURA YOSHINORI (JP)
Application Number:
PCT/JP2019/044663
Publication Date:
May 28, 2020
Filing Date:
November 14, 2019
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B32B15/04; H05K1/09
Domestic Patent References:
| WO2017149811A1 | 2017-09-08 |
Foreign References:
| JP5859155B1 | 2016-02-10 | |||
| JP2007307767A | 2007-11-29 | |||
| JP2017228693A | 2017-12-28 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Download PDF: