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Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/143619
Kind Code:
A1
Abstract:
Provided are: a multilayer ceramic electronic component wherein wet-spreading of a metal bump material is suppressed and the position of a metal bump is able to be controlled with high accuracy; and a method for manufacturing this multilayer ceramic electronic component. This multilayer ceramic electronic component 1 is provided with: a ceramic element 2 having first and second main surfaces 2a, 2b and first to fourth lateral surfaces 2c-2f; a first internal electrode 3a that is provided within the ceramic element 2 and is led out in the second lateral surface 2d; a second internal electrode 3b that is led out in the second lateral surface 2d and/or the fourth lateral electrode 2f and faces the first internal electrode 3a; a first electrode 4a that is provided on the first main surface 2a and contains a ceramic material; a first external electrode 5a that is connected to the first internal electrode 3a and is provided so as to extend over the first electrode 4a; and a second external electrode 5b that is connected to the second internal electrode 3b and is provided so as to extend over the first main surface 2a.

Inventors:
NAKAMURA, Kimitoshi (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
NAKASHIMA, Hisanobu (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2016/056367
Publication Date:
September 15, 2016
Filing Date:
March 02, 2016
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H01L41/047; H01G4/12; H01G4/232; H01G4/30
Domestic Patent References:
WO2014208376A12014-12-31
WO2011145453A12011-11-24
Foreign References:
JP2007109754A2007-04-26
JP2007074892A2007-03-22
JP2012064674A2012-03-29
JP2014063992A2014-04-10
JPH0670260U1994-09-30
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (Chuo Odori FN Bldg, 3-8 Tokiwamachi 1-chome, Chuo-ku, Osaka-sh, Osaka 28, 〒5400028, JP)
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