Title:
MULTILAYER CHIP FUSE AND METHOD OF MAKING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/060275
Kind Code:
A1
Abstract:
A multilayer chip fuse and a method for making the same belong to fuse filed. The multilayer chip fuse comprises a ceramic substrate (1), back electrodes (2), face electrodes (3), fuse parts (4,6,8), protective layers (5,7,9) and metal end heads (11,12). The fuse parts have multiple layers and the adjacent fuse parts are connected with each other end to end. Two end heads of the connected fuse parts are connected to face electrodes (3) on both sides of a ceramic substrate (1) respectively and the protective layer is provided on each layer of fuse part. During making, except the topmost protective layer, every other protective layer does not cover the ends of the fuse parts, thus a tandem constitution connected end to end is formed by multilayer fuse parts.
Inventors:
LU XIURONG (CN)
NAN SHIRONG (CN)
YANG MANXUE (CN)
NAN SHIRONG (CN)
YANG MANXUE (CN)
Application Number:
PCT/CN2009/001291
Publication Date:
June 03, 2010
Filing Date:
November 20, 2009
Export Citation:
Assignee:
NANJING SART SCIENCE & TECHNOL (CN)
LU XIURONG (CN)
NAN SHIRONG (CN)
YANG MANXUE (CN)
LU XIURONG (CN)
NAN SHIRONG (CN)
YANG MANXUE (CN)
International Classes:
H01H85/04
Foreign References:
| CN1925087A | 2007-03-07 | |||
| JPH06150802A | 1994-05-31 | |||
| US6034589A | 2000-03-07 | |||
| CN101441960A | 2009-05-27 |
Attorney, Agent or Firm:
ZHISHI LAW FIRM OF INTELLECTUAL PROPERTY (Nanjing Sci-Tech Center5# Xinmofan Road, Nanjing, Jiangsu 9, CN)
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