MULTILAYER CIRCUIT BOARD PROTECTION MECHANISM

WIPO Patent Application WO/2018/133180

A1

A multilayer circuit board protection mechanism comprises a first circuit board (1), a second circuit board (2), and a connecting component (3). The first circuit board (1) and the second circuit board (2) are adjacent and are disposed in parallel to each other. A first shielding case (4) is disposed on the first circuit board (1), a second shielding case (5) is disposed on the second circuit board (2). The first shielding case (4) and the second shielding case (5) are located between the first circuit board (1) and the second circuit board (2) and are relatively disposed. An opening (40, 50) is formed in each of the first shielding case (4) and the second shielding case (5), The connecting component (3) is disposed in a manner of penetrating through the openings (40, 50). A limit structure is disposed between the first shielding case (4) and the second shielding case (5), and the limiting structure can limit relative movement of the first shielding case (4) and the second shielding case (5) along a direction parallel to the first circuit board (1).

JPH06216557	ELECTROMAGNETIC SHIELD STRUCTURE
JP6266947	Shield case
JP2007173692	SWITCHABLE ELECTROMAGNETIC SHIELDING MATERIAL

DU HONGWEI (CN)
LI KELIN (CN)

PCT/CN2017/075903

July 26, 2018

March 07, 2017

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HUAWEI TECH CO LTD (CN)

H05K9/00; H04M1/02

CN105451441A	2016-03-30
CN1972587A	2007-05-30
CN202634510U	2012-12-26
CN201563343U	2010-08-25
CN102882995A	2013-01-16
US20100020520A1	2010-01-28
JP2011071827A	2011-04-07

BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)

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