MULTILAYER COIL COMPONENT AND METHOD FOR FABRICATING SAME

Title:

MULTILAYER COIL COMPONENT AND METHOD FOR FABRICATING SAME

Document Type and Number:

WIPO Patent Application WO/2007/072612

Kind Code:

A1

Abstract:

There is provided a multilayer coil component in which the stress concentration at an overlapped area, such as the area between a pad area and a via-hole conductor, is mitigated to obtain preferable characteristics and troubles such as a short-circuit failure and a mounting failure are eliminated. A method for fabricating the multilayer coil is also provided. In the multilayer coil component, ceramic layers (1) and coil conductors (11) are stacked each other and pad areas (12) formed at the end of the coil conductors (11) are interlayer-connected through via-hole conductors (13) to form a spiral coil. The thickness of the pad areas (12) is formed thinner than that of the coil conductors (11), thereby mitigating the concentration of the stress at the overlapped areas between the pad areas (12) and the via-hole conductors (13).

Inventors:

MIZUNO TATSUYA (JP)
MATSUSHIMA HIDEAKI (JP)

Application Number:

PCT/JP2006/317615

Publication Date:

June 28, 2007

Filing Date:

September 06, 2006

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)
MIZUNO TATSUYA (JP)
MATSUSHIMA HIDEAKI (JP)

International Classes:

H01F17/00; H01F41/04

Domestic Patent References:

WO2005052962A1

2005-06-09

Foreign References:

JPH1012455A	1998-01-16
JP2001358018A	2001-12-26
JPH07106175A	1995-04-21
JP2002273851A	2002-09-25
JP2004087596A	2004-03-18
JP2001274021A	2001-10-05
JP2001176725A	2001-06-29
JP2003017351A	2003-01-17
JPH08162352A	1996-06-21

Other References: