Title:
MULTILAYER CONDUCTIVE POLYMER DEVICE AND METHOD OF MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO1999045551
Kind Code:
A3
Abstract:
A conductive polymer device has conductive polymer layers sandwiched between external electrodes and internal electrodes. A device having three polymer layers is manufactured by: 1) providing a first laminated substructure comprising a first polymer layer between first and second metal layers, a second polymer layer, and a second laminated substructure comprising a third polymer layer betweem third and fourth metal layers; (2) forming first and second internal arrays of isolated metal areas in the second and third metal layers; (3) laminating the first and second substructures to opposite surfaces of the second polymer layer to form a laminated structure; (4) forming first and second external arrays of isolated metal areas in the first and fourth metal layers, respectively; (5) forming a plurality of first terminals, each electrically connecting one of the metal areas in the first external array to one of the metal areas in the second internal array, and a plurality of second terminals, each electrically connecting one of the metal areas in the second external array to one of the metal areas in the first internal array.
Inventors:
BARRETT ANDREW BRIAN
Application Number:
PCT/IB1999/000766
Publication Date:
December 02, 1999
Filing Date:
March 03, 1999
Export Citation:
Assignee:
BOURNS MULTIFUSE HONG KONG LTD (CN)
International Classes:
H01C1/14; H01C7/02; (IPC1-7): H01C7/02; H01C1/14
Foreign References:
| CN1088709A | 1994-06-29 | |||
| CN1148441A | 1997-04-23 | |||
| CN1130955A | 1996-09-11 |
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