Title:
MULTILAYER COPPER FOIL, METHOD FOR MANUFACTURING SAME, AND ELECTROPLATING APPARATUS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/225259
Kind Code:
A1
Abstract:
The present invention relates to a multilayer copper foil, a method for manufacturing same, and an electroplating apparatus therefor. A multilayer copper foil according to an aspect of the present invention comprises: a recrystallization active layer which is formed by electroplating a plating solution containing copper ions on the surface of a substrate; and a recrystallization suppressing layer which consists of the same composition as the recrystallization active layer, is laminated and formed on the surface of the recrystallization active layer by the plating solution, and suppresses recrystallization of the recrystallization active layer.
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Inventors:
LEE HYO JONG (KR)
SHIN HAN KYUN (KR)
KIM SANG HYEOK (KR)
SHIN HAN KYUN (KR)
KIM SANG HYEOK (KR)
Application Number:
PCT/KR2021/002172
Publication Date:
November 11, 2021
Filing Date:
February 22, 2021
Export Citation:
Assignee:
UNIV DONG A RES FOUND FOR IND ACAD COOP (KR)
International Classes:
C25D5/10; C25D1/04; C25D3/38; C25D5/00; C25D7/06; C25D21/12
Foreign References:
| JP2016113645A | 2016-06-23 | |||
| KR20200010033A | 2020-01-30 | |||
| KR20140081890A | 2014-07-01 | |||
| JP2014125679A | 2014-07-07 |
Other References:
JEONG YONGHO: "Retardation of Grain Growth of Copper Electrodeposits by Organic Additive", PROCEEDINGS OF THE KOREAN INSTITUTE OF SURFACE ENGINEERING 2016 FALL CONFERENCE, 30 November 2016 (2016-11-30), pages 139, XP055864596
Attorney, Agent or Firm:
JUN, Yong Cheul (KR)
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