Title:
MULTILAYER CURABLE RESIN FILM, PRE-PREG, LAMINATE BODY, CURED PRODUCT, COMPLEX, AND MULTILAYER CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2015/133513
Kind Code:
A1
Abstract:
Provided is a multilayer curable resin film containing: a first resin layer comprising a first curable resin composition that includes a polyphenylene ether oligomer (A1), which has a terminal modified by an aromatic vinyl group, and a curing agent (A2); and a second resin layer comprising a second curable resin composition that includes an alicyclic olefin polymer (B1), which contains a polar group, and a curing agent (B2). Also provided are a pre-preg containing the film and a fiber base material, a laminate body obtained using the same, a cured product, a complex, and a multilayer circuit board.
Inventors:
KAWAKAMI OSAMU (JP)
FUJITA SHIGERU (JP)
FUJITA SHIGERU (JP)
Application Number:
PCT/JP2015/056328
Publication Date:
September 11, 2015
Filing Date:
March 04, 2015
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
B32B27/00; C08J5/24; H05K3/46
Domestic Patent References:
| WO2013136975A1 | 2013-09-19 | |||
| WO2014064986A1 | 2014-05-01 |
Foreign References:
| JP2005105062A | 2005-04-21 |
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
It can exceed and is a patent business corporation. (JP)
It can exceed and is a patent business corporation. (JP)
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