Title:
MULTILAYER FILM AND MOLDED BODY PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2019/198827
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a multilayer film or a decorative film, which is composed of a base material layer and an adhesive material layer that is formed of a specific thermoplastic polymer composition, and which exhibits excellent chipping resistance; and a molded body which is provided with one of these films. The present invention achieves the above-described purpose by providing a multilayer film which comprises a base material layer and an adhesive material layer, and which is characterized in that: the adhesive material layer is formed of a thermoplastic polymer composition that contains 0-30 parts by mass of a polypropylene resin (B) relative to 100 parts by mass of a thermoplastic elastomer (A) that is at least one block copolymer, which contains a polymer block (S) that contains an aromatic vinyl compound unit and a polymer block (D) that contains a conjugated diene compound unit, or a hydrogenated product of the block copolymer; and the composition has a loss tangent (tanδ) of 3 × 10-2 or more at 11 Hz within the range of from -50°C to -20°C.
Inventors:
ENOMOTO KEISUKE (JP)
KONISHI DAISUKE (JP)
KONISHI DAISUKE (JP)
Application Number:
PCT/JP2019/016046
Publication Date:
October 17, 2019
Filing Date:
April 12, 2019
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C09J7/38; B29C48/16; B32B25/16; B32B27/00; B32B27/30; B32B27/32; C09J7/25; C09J153/02
Domestic Patent References:
| WO2017200014A1 | 2017-11-23 | |||
| WO2016031550A1 | 2016-03-03 | |||
| WO2016121868A1 | 2016-08-04 | |||
| WO2017043532A1 | 2017-03-16 | |||
| WO2017176997A1 | 2017-10-12 |
Foreign References:
| JP2018020487A | 2018-02-08 | |||
| JP2014168940A | 2014-09-18 | |||
| JPH05194923A | 1993-08-03 |
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