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Patent Searching and Data


Title:
MULTILAYER FILM FOR ULTRASONIC SEALING AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/166995
Kind Code:
A1
Abstract:
The present invention relates to a multilayer film for ultrasonic sealing and a package. Provided is a multilayer film for ultrasonic sealing, the multilayer film comprising at least a thermoplastic resin layer containing a thermoplastic resin, and a sealing layer containing a linear low-density polyethylene and an α-olefin resin, the α-olefin resin containing a butene-based α-olefin resin, and the multilayer film being capable of sealing by ultrasonic waves. Thus, the multilayer film for ultrasonic sealing is applicable to mono-materialization, is such that ultrasonic welding is possible, has sufficient rigidity, has a narrow sealing width, and is capable of having uniform and stable ultrasonic sealing strength.

Inventors:
AULIA AVERROES (JP)
Application Number:
PCT/JP2023/005348
Publication Date:
September 07, 2023
Filing Date:
February 16, 2023
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B65D65/40; B32B27/32
Foreign References:
JPH1191800A1999-04-06
JP2011207520A2011-10-20
JP2015013408A2015-01-22
JP2007245612A2007-09-27
JP2020200063A2020-12-17
JP2003340992A2003-12-02
JP2002210899A2002-07-31
JP2014105015A2014-06-09
JP2005319583A2005-11-17
Attorney, Agent or Firm:
ONO Takayuki (JP)
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