Title:
MULTILAYER FILM
Document Type and Number:
WIPO Patent Application WO/2019/065147
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of providing a multilayer film which is formed of a polyamide base film that has good barrier properties and good water-resistant adhesiveness even in a high-temperature high-humidity environment, and which is easily producible, while having excellent economic efficiency.
[Solution] A multilayer film which has a cover layer on at least one surface of a polyamide base film, and wherein: the cover layer is formed from a resin composition for cover layers, which contains a polyester resin as a constituent; an inorganic thin film layer is arranged on the cover layer; and a protective layer that contains a urethane resin having a meta-xylylene group is arranged on the inorganic thin film layer. This multilayer film is characterized in that the protective layer of this multilayer film has a surface hardness of from 220 N/mm2 to 310 N/mm2.
Inventors:
YAMAZAKI ATSUSHI (JP)
KOBAYASHI MASANORI (JP)
KOBAYASHI MASANORI (JP)
Application Number:
PCT/JP2018/033053
Publication Date:
April 04, 2019
Filing Date:
September 06, 2018
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B9/00; B32B27/34; B32B27/36; B32B27/40; C23C14/08
Foreign References:
| JP2006068967A | 2006-03-16 | |||
| JPH09174777A | 1997-07-08 | |||
| JP4524463B2 | 2010-08-18 | |||
| JPH0323934A | 1991-01-31 |
Download PDF: