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Title:
MULTILAYER INJECTION-MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2013/002073
Kind Code:
A1
Abstract:
A multilayer injection-molded body that contains the following: a layer (X) formed from a resin composition that contains a polyamide compound (A) and a resin (B); and a layer (Y) consisting primarily of another resin (C). The polyamide compound (A) contains the following: 25-50 mol% of diamine units which in turn include at least 50 mol% of a specific diamine unit; 25-50 mol% of dicarboxylic acid units which in turn include at least 50 mol% of a specific dicarboxylic acid unit; and 0.1-50 mol% of a specific constitutional unit.

Inventors:
ARAKAWA SHOTA (JP)
ODA TAKAFUMI (JP)
OTAKI RYOJI (JP)
ISHII KENTARO (JP)
Application Number:
PCT/JP2012/065647
Publication Date:
January 03, 2013
Filing Date:
June 19, 2012
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
ARAKAWA SHOTA (JP)
ODA TAKAFUMI (JP)
OTAKI RYOJI (JP)
ISHII KENTARO (JP)
International Classes:
B32B27/34; B29C45/00; B29C49/08
Domestic Patent References:
WO2012090797A12012-07-05
WO2011132456A12011-10-27
WO2011081099A12011-07-07
Foreign References:
JPH03273027A1991-12-04
JP2008503371A2008-02-07
Other References:
I.ARVANITOYANNIS ET AL., POLYMER, vol. 36, no. 15, 1995, pages 2957 - 2967, XP004025677
I.ARVANITOYANNIS ET AL.: "Studies in Polymer Science", BIODEGRADABLE PLASTICS AND POLYMERS, vol. 12, 1994, pages 562 - 569, XP008172704
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
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