Title:
MULTILAYER LAMINATED CIRCUIT BOARD WHEREIN RESIN FILMS HAVING DIFFERENT THERMAL EXPANSION COEFFICIENTS ARE LAMINATED
Document Type and Number:
WIPO Patent Application WO/2010/021278
Kind Code:
A1
Abstract:
A multilayer laminated circuit board (1) having a laminate structure wherein resin films (100) and circuit layers (200) are alternately laminated. The circuit layers (200) contain metal circuits (50), and one of the resin films (100) has a thermal expansion coefficient different from that of at least one of the other resin films (100). When the thickness of one of the resin films (100) is represented by A and the thickness of the circuit layer (200) adjacent to the resin film (100) is represented by B, the following relation: 0.015 ≤ B/A ≤ 8.75 is satisfied. When the area of one surface of one of the resin films (100) is represented by C and the area occupied by the metal circuit (50) formed on the surface of the resin film (100) is represented by D, the following relation: 0.2 ≤ D/C ≤ 0.7 is satisfied.
Inventors:
MIURA, Shigeki (8-36, Kamiji 3-chome, Higashinari-ku, Osaka-sh, Osaka 03, 〒5370003, JP)
Application Number:
JP2009/064230
Publication Date:
February 25, 2010
Filing Date:
August 12, 2009
Export Citation:
Assignee:
FCM CO., LTD. (8-36, Kamiji 3-chome Higashinari-ku, Osaka-sh, Osaka 03, 〒5370003, JP)
ＦＣＭ株式会社 (〒03 大阪府大阪市東成区神路３丁目８番３６号 Osaka, 〒5370003, JP)
ＦＣＭ株式会社 (〒03 大阪府大阪市東成区神路３丁目８番３６号 Osaka, 〒5370003, JP)
International Classes:
H05K3/46
Attorney, Agent or Firm:
FUKAMI, Hisao et al. (Fukami Patent Office, Nakanoshima Central Tower 22nd Floor, 2-7, Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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