MULTILAYER LAMINATED CIRCUIT BOARD

Title:

MULTILAYER LAMINATED CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2016/117436

Kind Code:

A1

Abstract:

The present invention provides a multilayer laminated circuit board having exceptional appearance with minimal change in color and good weathering resistance. This multilayer laminated circuit board is produced by laminating at least a transparent resin substrate [A], a metal oxide layer [C], an electrically conductive metal layer [D], a high-refractive index metal oxide layer [E], and a protective layer [F] including an inorganic oxide and/or an inorganic nitride, in that order, and satisfies the following conditions (1) and (2). (1) The thickness of the protective layer [F] is 5-300 nm. (2) The content, in mass%, of carbon included in the protective layer [F] is 50% or less, with respect to the total of metal elements, semimetal elements, and semiconductor elements included in the protective layer [F].

Inventors:

MAEDA YUKIHIRO (JP)
KITAGAWA MASAYUKI (JP)
TAKEDA MASANOBU (JP)

Application Number:

PCT/JP2016/050921

Publication Date:

July 28, 2016

Filing Date:

January 14, 2016

Export Citation:

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Assignee:

TORAY INDUSTRIES (JP)

International Classes:

B32B9/00; B32B15/04; G02B5/26

Foreign References:

JP2014194535A	2014-10-09
JP2014097623A	2014-05-29
JP2005290560A	2005-10-20
US20090117371A1	2009-05-07
JP2005224948A	2005-08-25

Other References: