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Patent Searching and Data


Title:
MULTILAYER LENS STRUCTURE, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/044538
Kind Code:
A1
Abstract:
The present technique relates to: a multilayer lens structure which is capable of tolerating variation in the amount of dripped energy curable resin that serves as a lens material; a method for producing this multilayer lens structure; and an electronic device. A multilayer lens structure according to the present invention comprises at least one first substrate with a lens and at least one second substrate with a lens, each of said substrate with a lens comprising a lens resin part that forms a lens and a carrier substrate that supports the lens resin part. The carrier substrate of the first substrate with a lens is configured by laminating a plurality of carrier constituent substrates in the thickness direction; and the carrier substrate of the second substrate with a lens is configured from a single carrier constituent substrate. The first substrate with a lens is provided with a groove in the lateral wall of a through hole that is formed in the carrier substrate. The present technique is applicable, for example, to a camera module and the like.

Inventors:
YOSHIOKA HIROTAKA (JP)
Application Number:
PCT/JP2018/030492
Publication Date:
March 07, 2019
Filing Date:
August 17, 2018
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G02B7/02; B29D11/00; G02B3/00; G02B7/04; G02B7/34; G02B7/36; G03B15/00; H01L27/146; H01L31/0232; H01L31/10
Foreign References:
JP2009003130A2009-01-08
JP2008262027A2008-10-30
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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