MULTILAYER METAL BALL

WIPO Patent Application WO/2018/056314

A1

Provided is a multilayer metal ball having a superior spacer function and high bond reliability. With this multilayer metal ball 1, deformation thereof when the multilayer metal ball 1 has been mounted to an electronic component can be suppressed, and to that extent, a multilayer metal ball 1 having a superior spacer function in a three-dimensional mounting such as a layered structure or an MCM can be achieved. Additionally, a multilayer metal ball with good sphericity can be achieved with this multilayer metal ball 1, and thus, to that extent, stability in array positioning during bonding is increased and bonding defects can be suppressed, and an effect of isotropically dispersing thermal warping during bonding can be increased. Thus, superior bond reliability in a post-mounting thermal cycling evaluation can be had with this multilayer metal ball 1. Consequently, a multilayer metal ball having a superior spacer function and high bond reliability is provided.

WO/2004/091846	HEAT EXCHANGER AND PROCESS FOR FABRICATING SAME
JP7041477	Conductive balls and electronic devices and their manufacturing methods
JP4933165	Wire drawing process for flux-cored wire for aluminum brazing Lubricating oil and wire drawing method for flux-cored wire for aluminum brazing using it

UNO TOMOHIRO (JP)
HASHINO EIJI (JP)
AKASHI KEISUKE (JP)
KIMURA KATSUICHI (JP)

PCT/JP2017/033932

March 29, 2018

September 20, 2017

Click for automatic bibliography generation  

NIPPON STEEL & SUMIKIN MAT CO (JP)
NIPPON MICROMETAL CORP (JP)

B23K35/14; B22F1/16; B23K35/26; C22C13/00; C22C13/02; C22C19/03

JPH0910986A	1997-01-14
JP2003225790A	2003-08-12
JP2011206815A	2011-10-20
JP2016095951A	2016-05-26
JP2016154139A	2016-08-25

YOSHIDA Tadanori (JP)

View/Download PDF      PDF Help

Previous Patent: MULTILAYER METAL BALL

Next Patent: MULTILAYER METAL BALL