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Patent Searching and Data


Title:
MULTILAYER MODULE, MODULAR FLOOR AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/091407
Kind Code:
A1
Abstract:
The present invention refers to a multilayer module (1), for exterior or interior use in a building, which comprises three layers, a first layer (2) corresponding to a coating (3) on the upper side of a section (4) of the multilayer module, a second layer (5) corresponding to the section (4) of the multilayer module, and a third layer (6) corresponding to the damping base (7) of the section (4) of the multilayer module, where each one of the three layers is respectively stacked sequentially; the section (4) of the multilayer module comprises male tongues (8) and female grooves (9) for insertion and fitting of the male tongues (8), having a gap between them for damping, and contributing to the quick maintenance or replacement of the modular floor. Additionally, the section (4) of the multilayer module allows longer durability of the module.

Inventors:
SIMÕES VICENTE RUI PEDRO (PT)
Application Number:
PCT/PT2020/050040
Publication Date:
May 14, 2021
Filing Date:
November 03, 2020
Export Citation:
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Assignee:
SIMOES VICENTE RUI PEDRO (PT)
International Classes:
E04F15/20; E04F15/02
Domestic Patent References:
WO2019177477A12019-09-19
Foreign References:
DE102016101667A12017-04-27
US20080127593A12008-06-05
US20090031658A12009-02-05
US20180202150A12018-07-19
Attorney, Agent or Firm:
INVENTA INTERNATIONAL S.A. (PT)
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