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Patent Searching and Data


Title:
MULTILAYER PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
Document Type and Number:
WIPO Patent Application WO/2018/110897
Kind Code:
A3
Abstract:
The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A multilayer printed circuit board (PCB) including a plurality of substrate layers formed in stack is provided. The multilayer printed circuit board includes a first substrate layer located on an outer side of the plurality of substrate layers, and a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer. The multilayer printed circuit board further includes a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.

Inventors:
HEO JINSU (KR)
KO SEUNGTAE (KR)
LIM SANGHO (KR)
Application Number:
KR2017/014289
Publication Date:
July 26, 2018
Filing Date:
December 07, 2017
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/11; H01Q1/38; H05K1/02
Foreign References:
EP2154747A12010-02-17
US20160066415A12016-03-03
US20150295296A12015-10-15
US20130093096A12013-04-18
US20100307798A12010-12-09
Other References:
See also references of EP 3510844A4
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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