Title:
MULTILAYER PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/169858
Kind Code:
A1
Abstract:
A multilayer printed circuit board (1) formed by laminating a plurality of wiring layers with insulating layers interposed therebetween, and provided with a solder resist layer (32) overlaying a surface wiring layer (30) formed on a surface side insulating layer (28). The surface wiring layer (30) contains a leg terminal pad (24) for connecting a leg terminal (18) of a connector (10). The solder resist layer (32) has an opening part (46) for leg terminal, for exposing one part of the leg terminal pad (24). Vias (48) for leg terminal are provided under the leg terminal pad (24) in a predetermined region straddling a border line of the opening part (46) for leg terminal. The vias (28) for leg terminal connect a first internal part wiring layer (54) with the leg terminal pad (24).
Inventors:
OKA KIYOSHI (JP)
KIDA SHINGO (JP)
ATSUMI NAOKI (JP)
SATO MITSURU (JP)
KIDA SHINGO (JP)
ATSUMI NAOKI (JP)
SATO MITSURU (JP)
Application Number:
PCT/JP2017/010751
Publication Date:
October 05, 2017
Filing Date:
March 16, 2017
Export Citation:
Assignee:
FDK CORP (JP)
International Classes:
H05K1/18; H01R12/51; H05K3/34; H05K3/46
Foreign References:
| JP2009021510A | 2009-01-29 |
Attorney, Agent or Firm:
NAGATO, Kanji (JP)
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