MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURE, AND TRANSFERRING PLATE AND ITS MANUFACTURE

WIPO Patent Application WO/1995/031886

A1

A transferring plate (10) is manufactured by forming an insulating masking layer (12') of a desired pattern on a conductive substrate (11) at least the surface of which is conductive, and forming a multilayer of a conductive layer (14) and an insulating resin layer (15) on the exposed portion of the conductive surface of the substrate (11). The wiring pattern composed of the conductive layer (14) and the insulating resin layer (15) formed on the plate (10) is transferred to a substrate (2) for a multilayer printed wiring board. Similar plates (10) having different wiring patterns are made and the patterns are transferred to the substrate (2). Therefore, a multilayer of wiring patterns (3, 4, 5, ...) are formed on the substrate (2). The patterns (3, 4, 5, ...) are respectively composed of conductive layers (3a, 4a, 5a, ...) and insulating resin layers (3b, 4b, 5b, ...).

YOSHINUMA HIROTO (JP)
KAWAI KENZABURO (JP)
KOBAYASHI SHINICHI (JP)

PCT/JP1995/000903

November 23, 1995

May 11, 1995

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DAINIPPON PRINTING CO LTD (JP)
YOSHINUMA HIROTO (JP)
KAWAI KENZABURO (JP)
KOBAYASHI SHINICHI (JP)

H05K1/11; H05K3/00; H05K3/20; H05K3/22; H05K3/46; H05K1/09; H05K3/14; H05K3/18; H05K3/32; H05K3/38; (IPC1-7): H05K3/46; H05K1/02; H05K1/11; H05K3/20; H05K3/40

JPH03270292A	1991-12-02
JPH05507391A	1993-10-21
JPH02101188A	1990-04-12
JPS635666U	1988-01-14
JPS5651337Y2	1981-12-01
JPS5916930B2	1984-04-18
JPH04260389A	1992-09-16
JPH04234192A	1992-08-21
JPS4891560A	1973-11-28
JPS5531639B1	1980-08-19
JPS5873186A	1983-05-02
JPH0715115A	1995-01-17

See also references of EP 0710062A4

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