Title:
MULTILAYER PRINTED WIRING BOARD, MULTILAYER METAL-CLAD LAMINATED BOARD, AND RESIN-COATED METAL FOIL
Document Type and Number:
WIPO Patent Application WO/2016/117282
Kind Code:
A1
Abstract:
The present invention relates to a multilayer printed wiring board which has one or more insulating layers 2 and which is formed by alternately laminating conductor layers 1 and insulating layers 2. Each of the one or more insulating layers 2 is formed from a polyolefin resin layer 3 only, a liquid crystalline polymer resin layer 4 only, or a polyolefin resin layer 3 and a liquid crystalline polymer resin layer 4. The total volume of liquid crystalline polymer resin layers 4 is 5-90 vol.% relative to the total volume of the one or more insulating layers 2.
Inventors:
TAKAHASHI HIROAKI
KOMORI KIYOTAKA
KOYAMA MASAYA
TOCHIHIRA JUN (JP)
HARADA RYU (JP)
KOMORI KIYOTAKA
KOYAMA MASAYA
TOCHIHIRA JUN (JP)
HARADA RYU (JP)
Application Number:
PCT/JP2016/000010
Publication Date:
July 28, 2016
Filing Date:
January 05, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
TOMOEGAWA CO LTD (JP)
TOMOEGAWA CO LTD (JP)
International Classes:
H05K3/46; B32B15/08; B32B27/20; B32B27/32; H05K1/03
Domestic Patent References:
| WO2013099172A1 | 2013-07-04 |
Foreign References:
| JP2012119446A | 2012-06-21 |
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
Yoshikiyo Nishikawa (JP)
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