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Title:
MULTILAYER REFLECTIVE FILM-ATTACHED SUBSTRATE, REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/037980
Kind Code:
A1
Abstract:
Provided is a multilayer reflective film-attached substrate having a multilayer reflective film which has a shallow effective reflection surface and in which the phenomenon of material atom diffusion between a low-refractive-index layer and a high-refractive-index layer can be suppressed. The multilayer reflective film-attached substrate comprises a substrate and a multilayer reflective film disposed on the substrate, wherein the multilayer reflective film includes a multilayer film in which low-refractive-index layers containing at least one selected from ruthenium (Ru) and rhodium (Rh) and high-refractive-index layers containing silicon (Si) are alternately laminated, and the low-refractive-index layer further contains an additive element having a work function in the range of more than 3.7 eV and less than 4.7 eV.

Inventors:
NAKAGAWA MASANORI (JP)
UMEZAWA TEIICHIRO (JP)
IKEBE YOHEI (JP)
Application Number:
PCT/JP2022/033127
Publication Date:
March 16, 2023
Filing Date:
September 02, 2022
Export Citation:
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Assignee:
HOYA CORP (JP)
International Classes:
G03F1/24; G21K1/06
Foreign References:
JP2021039271A2021-03-11
JP2014056960A2014-03-27
JP2006173446A2006-06-29
JP2006093454A2006-04-06
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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